- Part Status :
- Operating Temperature :
- Housing Material :
-
- Polyamide (PA46), Nylon 4/6 (9)
- Polyamide (PA46), Nylon 4/6, Glass Filled (19)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (9)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (6)
- Polyester (1)
- Polyethersulfone (PES), Glass Filled (1)
- Thermoplastic (2)
- Thermoplastic, Glass Filled (1)
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
50 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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GET PRICE |
728
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|
Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||
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3,360
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 18 (2 x 9) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | ||
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|
|
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2,852
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|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 18 (2 x 9) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | ||
|
|
3,287
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|
3M | CONN SOCKET SOIC 18POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 18 (2 x 9) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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|
|
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2,326
Ships today + free overnight shipping
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | - | 18 (2 x 9) | Beryllium Copper | - | Beryllium Copper | ||
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|
|
969
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 18 (2 x 9) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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3,181
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 18 (2 x 9) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
|
690
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 18 (2 x 9) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
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669
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 18 (2 x 9) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
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2,732
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 18 (2 x 9) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
|
865
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
|
3,191
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
|
1,149
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
|
2,219
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 18 (2 x 9) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
859
Ships today + free overnight shipping
|
Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 18 (2 x 9) | Beryllium Copper | - | Brass | |||
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|
|
1,736
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
1,024
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 18 (2 x 9) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
2,299
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
|
3,981
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
2,638
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
2,668
Ships today + free overnight shipping
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 18POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
|
1,297
Ships today + free overnight shipping
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 18POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
|
2,595
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 18 (2 x 9) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
3,592
Ships today + free overnight shipping
|
Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 18 (2 x 9) | Beryllium Copper | - | Brass | |||
|
|
|
693
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
3,718
Ships today + free overnight shipping
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
3,755
Ships today + free overnight shipping
|
Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 18 (2 x 9) | Beryllium Copper | - | Brass | |||
|
|
2,353
Ships today + free overnight shipping
|
Preci-Dip | CONN IC DIP SOCKET 18POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 18 (2 x 9) | Beryllium Copper | - | Brass | |||
|
|
|
1,115
Ships today + free overnight shipping
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 18 (2 x 9) | Beryllium Copper | 25.0µin (0.63µm) | Beryllium Copper | |||
|
|
|
719
Ships today + free overnight shipping
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 18 (2 x 9) | Beryllium Copper | 25.0µin (0.63µm) | Nickel |
