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5640 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Per Unit
$24.94
RFQ
2,753
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Preci-Dip CONN SOCKET PGA 361POS GOLD 517 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Gold 29.5µin (0.75µm) Tin 361 (18 x 18) Beryllium Copper - Brass
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Per Unit
$24.93
RFQ
3,094
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$24.90
RFQ
2,773
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Preci-Dip CONN SOCKET PGA 281POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 281 (19 x 19) Beryllium Copper - Brass
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Per Unit
$24.78
RFQ
3,631
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Preci-Dip CONN SOCKET PGA 281POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 281 (19 x 19) Beryllium Copper - Brass
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Per Unit
$24.72
RFQ
3,782
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Preci-Dip CONN SOCKET PGA 279POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 279 (19 x 19) Beryllium Copper - Brass
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Per Unit
$24.60
RFQ
3,999
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Preci-Dip CONN SOCKET PGA 279POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 279 (19 x 19) Beryllium Copper - Brass
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RFQ
1,269
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Harwin Inc. CONNECTOR D01-993 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Cup - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin - Tin 32 (1 x 32) Brass - Brass
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RFQ
1,472
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TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 4POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon, Glass Filled - Gold - Tin 4 (Round) Beryllium Copper - Brass
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RFQ
3,340
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Harwin Inc. CONN SOCKET SIP 46POS GOLD D01-950 Obsolete Tube -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 46 (1 x 46) Beryllium Copper - Brass
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RFQ
2,601
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TE Connectivity AMP Connectors CONN SOCKET PGA 168POS GOLD - Obsolete Bulk - Through Hole Solder Open Frame PGA Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 168 (17 x 17) Beryllium Copper 30.0µin (0.76µm) Brass
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RFQ
1,882
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TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 3POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon - Gold - Gold 3 (Round) Beryllium Copper - Brass
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RFQ
2,750
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TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 10POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon - Gold - Tin-Lead 10 (Round) Beryllium Copper - Brass
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RFQ
3,835
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Aries Electronics CONN SOCKET PGA GOLD PGM Obsolete Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,452
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Aries Electronics CONN SOCKET PGA GOLD PGM Obsolete Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
5-1437530-2
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RFQ
1,933
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TE Connectivity AMP Connectors CONN IC SIP SOCKET 8POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder - SIP Polyester 0.100" (2.54mm) Gold - Tin-Lead 8 (1 x 8) Beryllium Copper - Brass
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RFQ
2,029
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Harwin Inc. CONN IC DIP SOCKET 64POS GOLD D73064 Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, Staggered Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.050" (1.27mm) Gold - Tin 64 (2 x 32) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
1,547
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Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
3,573
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Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
728
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Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
3,185
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Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
1,890
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Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
1,060
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Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
3,934
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Harwin Inc. CONN IC DIP SOCKET 6POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
1,044
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Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
3,236
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Harwin Inc. CONN IC DIP SOCKET 22POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
876
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Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
2,860
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Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
1,176
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Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
2,187
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Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
3,435
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Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
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