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36 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,848
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NXP USA Inc. | SINGLE CORE 1.5M FLASH 192K RA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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2,910
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NXP USA Inc. | 32 BIT,2M FLASH,120MHZ | MPC57xx | Active | Tray | -40°C ~ 85°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,755
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NXP USA Inc. | SINGLE CORE 2M FLASH 256K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,811
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NXP USA Inc. | SINGLE CORE, 1.5M FLASH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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2,778
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NXP USA Inc. | 32 BIT SINGLE CORE 2M FLASH 256K | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,820
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NXP USA Inc. | 32 BIT SINGLE CORE 2M FLASH 256K | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,427
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NXP USA Inc. | 32 BIT,2M FLASH,256K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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849
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NXP USA Inc. | SINGLE CORE 1.5M FLASH 192K RA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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989
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NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 512 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,005
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NXP USA Inc. | IC MCU 32BIT 3MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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689
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NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 512 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,129
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NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 512K R | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,124
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NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,217
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NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 384 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,316
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NXP USA Inc. | IC MCU 32BIT 3MB FLASH 100MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,535
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NXP USA Inc. | 32 BIT SINGLE CORE 1.5M FLASH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,550
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NXP USA Inc. | S32K148 100 MAPBGA | S32K | Active | Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | I²S, POR, PWM, WDT | ARM® Cortex®-M4F | 112MHz | 2.7 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexIO, I²C, LIN, SPI, UART/USART | 2MB (2M x 8) | Flash | 4K x 8 | A/D 32x12b, D/A 1x8b | Internal | |||
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3,296
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NXP USA Inc. | S32K148 100 MAPBGA | S32K | Active | Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | I²S, POR, PWM, WDT | ARM® Cortex®-M4F | 112MHz | 2.7 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexIO, I²C, LIN, SPI, UART/USART | 2MB (2M x 8) | Flash | 4K x 8 | A/D 32x12b, D/A 1x8b | Internal | |||
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1,157
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NXP USA Inc. | S32K144, 100 MAPBGA | S32K | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | POR, PWM, WDT | ARM® Cortex®-M4F | 64MHz | 2.7 V ~ 5.5 V | - | 64K x 8 | 32-Bit | CAN, FlexIO, I²C, LIN, SPI, UART/USART | 512KB (512K x 8) | Flash | 4K x 8 | A/D 16x12b, D/A 1x8b | Internal | |||
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2,003
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NXP USA Inc. | S32K144 100 MAPBGA | S32K | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | POR, PWM, WDT | ARM® Cortex®-M4F | 80MHz | 2.7 V ~ 5.5 V | - | 64K x 8 | 32-Bit | CAN, FlexIO, I²C, LIN, SPI, UART/USART | 512KB (512K x 8) | Flash | 4K x 8 | A/D 16x12b, D/A 1x8b | Internal | |||
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3,085
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NXP USA Inc. | DUAL CORE 2M FLASH 256K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z2, e200z4 | 80MHz, 160MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,703
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NXP USA Inc. | SINGLE CORE, 3M FLASH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,773
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NXP USA Inc. | 32 BIT,SINGLE CORE,2M FL | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,738
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NXP USA Inc. | 32 BITSINGLE CORE2M FL | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,872
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NXP USA Inc. | 32 BIT SINGLE CORE 2M FLASH 1 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,595
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NXP USA Inc. | SINGLE CORE 3M FLASH 384 RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,577
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NXP USA Inc. | 32 BIT SINGLE CORE 2M FLASH 2 | MPC57xx | Active | Tray | -40°C ~ 85°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,554
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NXP USA Inc. | 32 BIT,2M FLASH,256K RAM | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,502
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NXP USA Inc. | SINGLE CORE 1.5M FLASH 192K RA | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,609
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NXP USA Inc. | SINGLE CORE 1.5M FLASH 192K RA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal |
