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| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI | DCON,25P,SNB | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.025" (0.64mm) | 2.280" (57.91mm) | 0.690" (17.53mm) | Tin | 299.21µin (7.60µm) | Slot |
