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IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Type | Wire Gauge | Diameter | Form | Composition | Melting Point | Flux Type | Process | Shelf Life | |
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Multicore | HMP 366 3% .022DIA. 23AWG | 366 | Active | Wire Solder | 23 AWG, 24 SWG | 0.022" (0.56mm) | Spool, 8.8 oz (250g) | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | Leaded | Shelf Life Not Applicable |