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- Manufacturer :
- Chip Quik Inc.
- Product Category :
- Solder
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 8.8 oz (250g)
- Melting Point :
- 423 ~ 428°F (217 ~ 220°C)
- Part Status :
- Active
- Process :
- Lead Free
- Series :
- -
- Shelf Life :
- 12 Months (Date of Manufacture)
- Type :
- Solder Paste
- Wire Gauge :
- -
- Datasheet :
- TS391SNL250
Cross References
-
Stock 1,871
-
Stock 1,056
-
Stock 3,743
-
Stock 2,591
-
Stock 3,515
PEOPLE WHO BOUGHT Solder ALSO BOUGHT
-
Stock 1,453
-
Stock 1,386
-
Stock 790
-
Stock 1,384
-
Stock 723
PEOPLE VIEWING TS391SNL250 THEN BOUGHT
-
Stock 2,031
-
Stock 3,883
-
Stock 3,343
-
Stock 3,612
-
Stock 789
Lastest News
05/13/2019
05/13/2019
05/09/2019
Search Part Number: "TS39" Included word is 15
| Part Number | Manufacturer | Stock | Description |
|---|---|---|---|
| TS391LT250 | Chip Quik Inc. | 1,871 | THERMALLY STABLE SOLDER PASTE NO |
| TS391LT500C | Chip Quik Inc. | 1,056 | THERMALLY STABLE SOLDER PASTE NO |
| TS391SNL500C | Chip Quik Inc. | 3,743 | THERMALLY STABLE SOLDER PASTE NO |
| TS391AX500C | Chip Quik Inc. | 2,591 | THERMALLY STABLE SOLDER PASTE NO |
| TS391AX250 | Chip Quik Inc. | 3,515 | THERMALLY STABLE SOLDER PASTE NO |
| TS391SNL10 | Chip Quik Inc. | 1,147 | THERMALLY STABLE SOLDER PASTE NO |
| TS391LT10 | Chip Quik Inc. | 1,609 | THERMALLY STABLE SOLDER PASTE NO |
| TS391AX10 | Chip Quik Inc. | 3,203 | THERMALLY STABLE SOLDER PASTE NO |
| TS391LT50 | Chip Quik Inc. | 1,857 | THERMALLY STABLE SOLDER PASTE NO |
| TS391SNL50 | Chip Quik Inc. | 1,602 | THERMALLY STABLE SOLDER PASTE NO |
| TS391SNL | Chip Quik Inc. | 3,831 | THERMALLY STABLE SOLDER PASTE NO |
| TS391LT | Chip Quik Inc. | 2,258 | THERMALLY STABLE SOLDER PASTE NO |
| TS391AX | Chip Quik Inc. | 2,401 | THERMALLY STABLE SOLDER PASTE NO |
| TS391AX50 | Chip Quik Inc. | 1,821 | THERMALLY STABLE SOLDER PASTE NO |
| TS39104CS RLG | Taiwan Semiconductor Corporation | 1,356 | LINEAR REGULATOR, ADJ. VOUT, 1A, |
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